Conductive Anodic Filamentation (CAF)
CAF is a failure mechanism which is found in Printed Circuit Boards (PCB). It is the creation of a micro conductive or semi-conductive path between two conductive poles. As shown in the photos belowThese are thankfully rare but difficult to find and analyse - very...
FR4 Laminate Variants
Base laminate used in the construction of Printed Circuits Boards can come in many different forms from simple Paper & Resin to exotic hybrid materials. The price of the material also varies from inexpensive to prohibitive. The cost is mainly based on a supply...
How Printed Circuit Boards Are Made
A brief outline of the stages in making a plated Though Hole(PTH) Printed circuit board PCB’s have been made for over 80 years and their complexity has increased with the constant march of the Electronics Industry. Materials have also changed due to applications and...
Printed circuits made with the silk screen technique
Note: The development time of the silk and drying of the cards exposed here, changes depending on the quality of the ink, the type of bulb used and the distance of the light, when exposing the cards. We recommend doing tests until you find the times, that you delay,...